Products catalog

SMI-ED provides pressed ceramics in wide range of forms including irregular shapes, by our advanced pressing technology. Smaller lots can be complied just to required amounts, by applying alternative method of green forming or mechanical processing. For testing or developmental purpose, mechanical...

SMI-ED provides small ceramic packages oriented to surface mounting, for hermetic sealing with sealants of seam weld, Au/Sn, glass types etc. Features Advantages in hermeticity and heat resistance, by use of alumina ceramic material. Applications ...

We prepare piezoelectric materials that are used in for various kinds of applications. We can provide HIP materials more closely-packed than normal. As piezoelectric products, we also prepare laminated actuators for accurate positioning and bi-morph actuators for valve.

Recently in RF power device, packages are required to provide a measure to suppress high heating. We developed and now release packages using Cu laminate H/S(CPC, SPC) that exceed traditional Cu/W & H/S in heat release.

Koplena wave guide type via structureThis package uses laminated alumina. (W electrode + Au/Ni plating)Ribbon/Wire type, BGA/Lead type [In the time of secondary mounting]Seal by Kovar ring + Kovar rid and ceramic capReady for cavity (depth>0.1mm:in the case of ceramic base)Others, Structural...

[Millimeter wave communication package] V-SAT, LMDS, FWA, W-LAN, communication between cars, home link, etc.[Optical communication, Electronic device package] OC192, OC768, and others

Broad band and high transmission characteristic; DC to 77GHz, -1dB to 77GHzReady for surface mounting; BGA structure, lead terminal structure (DC to 40GHz)Provision for heat release; with heat slugHigh reliability; hermetic seal

Features 1.High thermal conductivity ・Alumina 17W/mK ・Aluminum nitride 120W/mK 2.Highly reflective ceramic material ・Alumina base （Developing, HR55） 92％ ・Alumina base （Developing,　P-318） 90％ ＊Reflectivity at λ=460nm, substrate thickness: t=1.0mm 3.Surface Mount Technology ...

LED（Light Emission Diode) : currently adopted by various electronic equipments including liquid crystal back-light etc. With further enhanced optical outputting, applications are expanding to automotive and home lighting. SMI-ED provides LED substrates to satisfy requirements, through utilization...

We supply all-round types of sealing lid for various packages including ceramic and others. As for the sealant, we offer wide variety of material, glass and epoxy etc. We can also pre-assemble image sensor packages (CMOS, CCD) in cerdip type, by combination of ceramic substrate, lead frame and...

We prepare piezoelectric materials that are used in for various kinds of applications. We can provide HIP materials more closely-packed than normal. As piezoelectric products, we also prepare laminated actuators for accurate positioning and bi-morph actuators for valve.